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課程名稱 |
晶片系統封裝
System in Package |
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開課學期 |
102-2 |
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授課對象 |
電機資訊學院 電機工程學研究所 |
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授課教師 |
盧信嘉 |
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課號 |
EEE5025 |
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課程識別碼 |
943 U0270 |
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班次 |
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學分 |
3 |
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全/半年 |
半年 |
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必/選修 |
選修 |
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上課時間 |
星期二6,7,8(13:20~16:20) |
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上課地點 |
電二104 |
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備註 |
總人數上限：50人 |
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Ceiba 課程網頁 |
http://ceiba.ntu.edu.tw/1022sip |
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課程簡介影片 |
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核心能力關聯 |
核心能力與課程規劃關聯圖 |
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課程大綱
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課程概述 |
Scopes: Semiconductor IC Packaging/Testing/Assembly/Reliability Basics, Substrates for Embedded Passives, Electrical/Thermal/Stress Analysis, Applications of System in Package..
Contents:
1. Introduction to electronic packaging
2. Flip-chip, stacked, 3D packages, CBGA (ceramic ball grid array) and CCGA (ceramic column grid array)
3. Technology trend of advanced semiconductor packaging
4. Electrical design/analysis of system in package
5. Thermal/Stress analysis of system in package
6. Testing/Reliability of system in package
7. IPD (Integrated Passive Devices)
8. Applications of system in package |
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課程目標 |
待補 |
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課程要求 |
Prerequisites: (recommended but not required)
Integrated circuit design, analog integrated circuit design
Spice or similar circuit simulator is required to do some simulation homeworks in this course. |
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預期每週課後學習時數 |
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Office Hours |
每週四 11:00~12:00
每週三 15:30~16:30 備註： 編號1:沈祺凱 助教 電二 522 每週三 15:30~16:30。 編號2 蔡涵昀 助教 電二533 每
週四 11:00~12:00 |
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指定閱讀 |
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參考書目 |
教科書： Richard K. Ulrich and William D. Brown, “Advanced Electronic Packaging” 2/e, IEEE Wiley-interscience, 2006
參考書目：
1. Fundamentals of Microsystems Packaging by R.R. Tummala, McGraw Hill, 2001
2. Integrated Passive Component Technology, by R.K. Ulrich and L.W. Schaper, Wiley, 2003.
3. 邱碧秀，”微統封裝原理與應用,” 滄海書局, 2005
4. Introduction to System-on-package, by R.R. Tummala, McGraw Hill, 2008 華通書坊
5. Advanced Millimeter-wave Technologies: Antennas, Packaging and Circuits edited by Duixian Liu, Ulrich Pfeiffer, Janusz Grzyb, Brian Gaucher, Wiley, 2009
6. Electrical Modeling and Design for 3D System Integration: 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC by Er-Ping Li, Wiley, 2012.
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評量方式
(僅供參考) |
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No. |
項目 |
百分比 |
說明 |
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1. |
Homework |
30% |
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2. |
Mini-project |
10% |
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3. |
Mid-term exam |
30% |
in-class, open-book, open-note |
4. |
Final exam |
30% |
in-class, open-book, open-note |
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週次 |
日期 |
單元主題 |
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第1週 |
2/18 |
SiP overview / Introduction |
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第2週 |
2/25 |
Material and processing technologies for packaging |
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第3週 |
3/04 |
Processing technology and organic material |
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第4週 |
3/11 |
Ceramic material |
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第5週 |
3/18 |
Electrical design |
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第6週 |
3/25 |
Electrical design |
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第7週 |
4/01 |
Thermal considerations |
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第8週 |
4/08 |
Discrete and embedded passives |
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第9週 |
4/15 |
Midterm exam |
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第10週 |
4/22 |
Integrated Inductors |
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第11週 |
4/29 |
Basic IC assembly |
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第12週 |
5/06 |
Basic IC assembly |
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第13週 |
5/13 |
Reliability |
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第14週 |
5/20 |
RF SoP |
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第15週 |
5/27 |
老師出國 停課一次 |
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第16週 |
6/03 |
Mini-project presentation |
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第17週 |
6/10 |
Mini-project presentation |
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第18週 |
6/17 |
Final exam |
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